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Activity overview

Latest activity by Aaron
  • Aaron commented,

    It's not a via, it's a physical drill hole in the board (a through hole pin is passing through it), and there's a pad I placed on top of that hole to allow me to solder the pin as it protrudes thro...

  • Aaron commented,

    No the pad only appears on the top copper layer, it doesn't appear as a connection on any other layer.  Spec for the pad is 2mm with a hole size of 1.2mm, when I show the power plane again (like in...

  • Aaron commented,

    The pads for the pogo pins are on the top side of the board, so top copper layer, then there's the GND layer, VCC layer and then bottom copper layer. The image is showing the top copper layer, but ...

  • Aaron commented,

    I actually didn't use the copper pour function at all when creating the board.  I looked at some basic pro's and con's for doing it and just figured I didn't need it.  I assumed this is why I can't...

  • Aaron created a post,

    Creating Thermal Relief Vias

    Hi all,  Just created a small PCB design which uses 4 pogo pins which go through the board and are soldered on the top.  The issue I'm having is I need to pre heat the board to get the solder to fl...