Just created a small PCB design which uses 4 pogo pins which go through the board and are soldered on the top.
The issue I'm having is I need to pre heat the board to get the solder to flow, I assume this is because the entire ground plane is acting as a heat sink (it's a 4 layer board with VCC and GND as seperate layers)
Could I improve this in future designs by using thermal relief pads?
The pogo pin pads aren't power connections so they didn't automatically get thermal relief spokes when I sent off the data for manufacture, so is there a way to do this manually??
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