Can we please add the ability to add blind, buried and thermal vias to PCB's.
I have read the posts regarding thermal vias and these obviously also need to be addressed as modern D2PAK and other components often require thermal transfer vias. e.g. IMS PCB designs.
I suggest a component design as a buried, blind or thermal via by eliminating the pads, drilling hole and solder mask/s on specific layers. These can be added to the PCB at design time and do not need to be shown on the schematic.
As a next step, (and if not too complicated), adding them to a component footprint would be highly desirable, especially for thermal vias. But if this would be too complex for developers, adding them as extras at PCB layout time would be an acceptable solution.
Obviously the drilling and Gerber output files would need to define these for manufacture, probably this is the more complicated, and most important part, of the implementation?
Keep up the good work on DS PCB it is a great piece of software.
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